软板高达14层/软硬结合板高达40层

嵌入式无源元件

射频与微波软结合

混合介质层压

HDI微孔2MIL

混合介质层压

1.5/1.5mil  线路/间距

多种表面处理组合

软硬结合位环氧树脂点胶

铝基和铜基板散热处理

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